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• COOLPhase® PH 1038 phase change thermal pad

  • Specific Gravity [g/cm3]: 1,30
  • Operating Temperature [°C]: -45 to 125
  • Thermal Conductivity vertical [W/m.K]: 3,8
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,13
  • Thickness [mm]: 0,25 to 1,00
  • Dielectric Strengh [kV/mm]: 3,00

• Thermal Interfaces

  COOLPad® Silicon Thermal PADs COOLPad® is a line of high performance thermal interface pads, developed to address the industry’s growing requirements for easy application, low levels of thermal resistance and high conformability, even at the most challeging and uneven surfaces.  high compressibility low thermal...

• COOLPhase® PH 1045 phase change thermal pad

  • Specific Gravity [g/cm3]: 1,35
  • Operating Temperature [°C]: -45 to 125
  • Thermal Conductivity vertical [W/m.K]: 4,5
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,20
  • Thickness [mm]: 0,25 to 1,00
  • Dielectric Strengh [kV/mm]: 4,00

• COOLPad® CP1015FG conformable thermal gap filler & pad

  • Specific Gravity [g/cm3]: 2,30
  • Operating Temperature [°C]: -60 to 200
  • Thermal Conductivity vertical [W/m.K]: 1,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: 0,25-5,0
  • Dielectric Strengh [kV/mm]: > 4,0

• COOLPhase® PH 1055 phase change thermal pad

  • Specific Gravity [g/cm3]: 13,50
  • Operating Temperature [°C]: -45 to 125
  • Thermal Conductivity vertical [W/m.K]: 5,5
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,55
  • Thickness [mm]: 0,25 to 1,00
  • Dielectric Strengh [kV/mm]: 4,00

• COOLPad® CP1030 conformable thermal gap filler & pad

  • Specific Gravity [g/cm3]: 2,30
  • Operating Temperature [°C]: -60 to 200
  • Thermal Conductivity vertical [W/m.K]: 3,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: 0,25-5,0
  • Dielectric Strengh [kV/mm]: > 4,0

• COOLPad® CP1020 conformable thermal gap filler & pad

  • Specific Gravity [g/cm3]: 2,30
  • Operating Temperature [°C]: -60 to 200
  • Thermal Conductivity vertical [W/m.K]: 2,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: 0,25-5,0
  • Dielectric Strengh [kV/mm]: > 4,0

• COOLPad® CP1050 conformable thermal gap filler & pad

  • Specific Gravity [g/cm3]: 2,30
  • Operating Temperature [°C]: -60 to 200
  • Thermal Conductivity vertical [W/m.K]: 5,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: 0,25-5,0
  • Dielectric Strengh [kV/mm]: > 4,0

• COOLPad® CP1060 conformable thermal gap filler & pad

  • Specific Gravity [g/cm3]: 2,30
  • Operating Temperature [°C]: -60 to 200
  • Thermal Conductivity vertical [W/m.K]: 6,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: 0,25-5,0
  • Dielectric Strengh [kV/mm]: > 4,0

• COOLPad® CP1012 conformable thermal gap filler & pad

  • Specific Gravity [g/cm3]: 3,40
  • Operating Temperature [°C]: -60 to 200
  • Thermal Conductivity vertical [W/m.K]: 12,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: 0,25-5,0
  • Dielectric Strengh [kV/mm]: > 5,0

• FlexGRAF®FG500 thermally conductive foil / Wärmeleitfolie

  • Specific Gravity [g/cm3]: 1,5 to 1,6
  • Operating Temperature [°C]: -40 to 400
  • Thermal Conductivity vertical [W/m.K]: 350
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,34
  • Thickness [mm]: 0.13
  • Dielectric Strengh [kV/mm]: n/a

• FlexGRAF®FG500 0,13x13,5x13,5mm thermally conductive foil / Wärmeleitfolie

  • Specific Gravity [g/cm3]: 1,5 to 1,6
  • Operating Temperature [°C]: -40 to 400
  • Thermal Conductivity vertical [W/m.K]: 350
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,34
  • Thickness [mm]: 0.13
  • Dielectric Strengh [kV/mm]: n/a

• FlexGRAF®FG500 0,13x19x19mm thermally conductive foil / Wärmeleitfolie

  • Specific Gravity [g/cm3]: 1,5 to 1,6
  • Operating Temperature [°C]: -40 to 400
  • Thermal Conductivity vertical [W/m.K]: 350
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,34
  • Thickness [mm]: 0.13
  • Dielectric Strengh [kV/mm]: n/a

• FlexGRAF®FG500 0,13x28x28mm thermally conductive foil / Wärmeleitfolie

  • Specific Gravity [g/cm3]: 1,5 to 1,6
  • Operating Temperature [°C]: -40 to 400
  • Thermal Conductivity vertical [W/m.K]: 350
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,34
  • Thickness [mm]: 0.13
  • Dielectric Strengh [kV/mm]: n/a

• FlexGRAF®FG500 0,13x38x38mm thermally conductive foil / Wärmeleitfolie

  • Specific Gravity [g/cm3]: 1,5 to 1,6
  • Operating Temperature [°C]: -40 to 400
  • Thermal Conductivity vertical [W/m.K]: 350
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,34
  • Thickness [mm]: 0.13
  • Dielectric Strengh [kV/mm]: n/a

• FlexGRAF®FG700 thermally conductive foil / Wärmeleitfolie

  • Specific Gravity [g/cm3]: 1,5 to 1,6
  • Operating Temperature [°C]: -40 to 400
  • Thermal Conductivity vertical [W/m.K]: 350
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,42
  • Thickness [mm]: 0.25
  • Dielectric Strengh [kV/mm]: n/a

• FlexGRAF® FG1000 thermally conductive foil / Wärmeleitfolie

  • Specific Gravity [g/cm3]: 1,5 to 1,6
  • Operating Temperature [°C]: -40 to 400
  • Thermal Conductivity vertical [W/m.K]: 350
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,55
  • Thickness [mm]: 0.5
  • Dielectric Strengh [kV/mm]: n/a

• THERMALTape®TT900 thermally conductive double sided tape

  • Specific Gravity [g/cm3]: n/a
  • Operating Temperature [°C]: -20 to 120
  • Thermal Conductivity vertical [W/m.K]: >1,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 2,16
  • Thickness [mm]: 0.25
  • Dielectric Strengh [kV/mm]: > 4,0

• FORMAPad®FP GI-5100 thermally conductive paste / Wärmeleitpaste

  • Specific Gravity [g/cm3]: 2,20
  • Operating Temperature [°C]: 55 to 205
  • Thermal Conductivity vertical [W/m.K]: 2,60
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 0,025
  • Thickness [mm]: n/a
  • Dielectric Strengh [kV/mm]: 2,8

• THERMALTape® TT1200 thermally conductive double sided tape

  • Specific Gravity [g/cm3]: n/a
  • Operating Temperature [°C]: -20 to 120
  • Thermal Conductivity vertical [W/m.K]: >1,0
  • Thermal Impedance @ 700 kPa [K-cm²/W]: 3,02
  • Thickness [mm]: 0.5
  • Dielectric Strengh [kV/mm]: n.a

• LEDGlue®LG4000 thermal conductive silicone adhesive

  • Specific Gravity [g/cm3]: 2,2
  • Operating Temperature [°C]: -40 to 200
  • Thermal Conductivity vertical [W/m.K]: 1,00
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: n/a
  • Dielectric Strengh [kV/mm]: 10,00

• FlexCOAT® FC60 conformal coating

  • Specific Gravity [g/cm3]: 0,916
  • Operating Temperature [°C]: -40 to 130
  • Thermal Conductivity vertical [W/m.K]: 0,02
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: n/a
  • Dielectric Strengh [kV/mm]: 15,00

• Technical Sealants

  FlexSEAL FS10010® FlexSEAL FS10010® is a silicone type adhesive which cures after absorbing moisture in the air, at room temperature, with no need for heat curing. It has good adhesive sealing performance and outstanding protection in harsh operational conditions. FlexCOAT® FC60 FlexCOAT FC60 is a high quality...

• FlexSEAL FS10010® silicone adhesive sealant

  • Specific Gravity [g/cm3]: 1,0 to 1,1
  • Operating Temperature [°C]: -20 to 140
  • Thermal Conductivity vertical [W/m.K]: 0,4
  • Thermal Impedance @ 700 kPa [K-cm²/W]: n/a
  • Thickness [mm]: n/a
  • Dielectric Strengh [kV/mm]: 20,00

• Encapsulation and Shielding

  PoliCAP is an innovative bi-component 2K resin, expertly designed for encapsulating LEDs and electronic components. It stands out for its fast curing capability at room temperature, ensuring a smooth, aesthetically pleasing finish, and excellent thermal expansion properties. USP's excellent light transmission...