Bluetooth & WiFi

Classic Bluetooth® technology is particularly suitable for applications with high data rates (up to 3 Mbit), with a network size of less than or equal to eight nodes.

Bluetooth® Smart Ready technology (Classic Bluetooth® and Bluetooth® Low Energy)
Bluetooth® Smart Ready devices can receive data sent by Classic Bluetooth® devices and Bluetooth® Smart devices (Bluetooth® Low Energy). The modules can be easily integrated into gateway/host devices, e.g. for industrial, automation, medical and fitness products.

Bluetooth® Smart technology (Bluetooth® Low Energy)
Bluetooth® Low Energy technology reduces power consumption to a tenth of that of a classic Bluetooth® module. It is only active when data needs to be sent, for example, and is otherwise in sleep mode.



There are 8 of 8 products shown.

GD32VW553-MINI-IMK6

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 20 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: yes
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 85 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
  • Manufacturer: GigaDevice
GD32VW553-MINI-IMK6

GD32VW553-MINI-IMK7

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 20 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: yes
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 105 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
  • Manufacturer: GigaDevice
GD32VW553-MINI-IMK7

GD32VW553-MINI-EMK7

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 20 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: no
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 105 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
  • Manufacturer: GigaDevice
GD32VW553-MINI-EMK7

GD32VW553-MINI-EMK6

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 20 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: no
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 85 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
  • Manufacturer: GigaDevice
GD32VW553-MINI-EMK6

GD32VW553-UNIFI-IMH7

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 18 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: yes
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 105 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
  • Manufacturer: GigaDevice
GD32VW553-UNIFI-IMH7

GD32VW553-UNIFI-IMH6

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 18 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: yes
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 85 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
  • Manufacturer: GigaDevice
GD32VW553-UNIFI-IMH6

GD32VW553-UNIFI-EMH7

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 18 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: no
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 105 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
  • Manufacturer: GigaDevice
GD32VW553-UNIFI-EMH7

GD32VW553-UNIFI-EMH6

  • CPU: RISC-V 32-bit processor up to 160 MHz ; 4 MB (4096 KB) Flash ; 320 KB SRAM (288 KB + 32 KB shared memory)
  • Interfaces: 18 GPIOs ADC, UART, SPI, I2C
  • Embedded Antenna: no
  • min. operating temperature [°C]: -40 °C
  • max. operating temperature [°C]: 85 °C
  • Power supply [V]: 3.0~3.6
  • Security: CAU, HAU, TRNG, CRC, ECC, EFUSE
GD32VW553-UNIFI-EMH6
Interfaces

Embedded Antenna

Max. operating temperature

Min. operating temperature

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endrich provides design-in distribution of high-quality electronic components. We attach great importance to quality and reliability. That is why we work very closely with our suppliers to ensure that our products meet the highest standards. Our experienced team is always on hand to help and advise you in selecting the right components for your requirements.

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